We thank the generous contributions of time and expertise from our Technical Program Committee members listed below in alphabetical order:

  • David Burnett – Villanova University
  • Tengfei Chang – HKUST-GZ
  • Kapinesh Govindaraju – Micron Technology
  • Danny Hughes – KU Leuven
  • Ye Liu – Nanjing Agricultural University
  • Xiaoyuan Ma – SKF Group
  • Filip Maksimovic – Inria
  • Liam McSherry – University of Oxford
  • Trifun Savic – University of Montenegro
  • Xavier Vilajosana – Universitat Oberta de Catalunya
  • Yadong Wan – USTB
  • Thomas Watteyne – Inria
  • Dan Xia – Beijing University of Posts and Telecommunications